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Almost all electronic gadgets and devices have printed circuit boards as part of the components that constitute them. Manufacturing of PCB is not a difficult process and even amateur electricians can just provide the manufacturer with their own designs in order to get it done. The boards are divided into three categories; multi layer, single and double side boards. Conduction of these boards is usually done using copper, nickel or aluminum based material. The material is chosen depending on how complex or dense the circuits are. Described here is the process followed when going about creating them and the stages involved.
The backing is first plated with a conductive material. Holes are then drilled into it in order for conduction to take place in between the layers and also to mount electronic components. The board is then scrubbed to get rid of any small particles of the conductor. Such particles can be later on recycled from the water by using a process such as filtration. Any copper particles left behind can easily mix with other wastes and become pollutant to the environment.
The board is then cleaned. Etching also takes place to allow for proper adhesion in the next stage. Once this has been carried out, there is an addition of another layer of conductor. The process of electrolysis copper plating is applied in order to conduct the holes that had been drilled previously. Both alkaline based and acidic based solutions such as copper sulfate can be used to enhance pH balance.
Photo imaging is used to achieve the final design of the circuit. The final thickness is also arrived at by electroplating copper. Protection of the final circuits in the next etching is quite vital and hence, a thin layer of tin or lead solder should be applied. The copper will not form the final circuit and should therefore be removed. Sulfuric acid or a solution containing ammonia is used to etch away the unwanted copper.
Other organic or photosensitive compounds can be used to obtain alternative resists. The compounds can be used when wet or dry. They will become hard when they are exposed to ultraviolet light.
In order to spread the liquid resist, one can use a silk screen, squeegee, roller or spray. One or both sides can have the liquid on. However, application can also be done to a specific area on the surface. Finer circuits can be produced by use of light.
The formation of multi layer panels is the final stage of this process. The inner cores of the layer are put together. The panels that are assembled together look like a copper foiled book with alternating epoxy sheets.
The book is positioned into a laminating press and then high pressure as well as heat is applied to it. The intense heat will eventually cause the sheets to melt down and a bond will be formed. Next, there are holes that are drilled into it. Prior to this, it should undergo some trimming and buffing. Manufacturing of PCB can only be successful if all these steps and guidelines are clearly followed to the latter.
The backing is first plated with a conductive material. Holes are then drilled into it in order for conduction to take place in between the layers and also to mount electronic components. The board is then scrubbed to get rid of any small particles of the conductor. Such particles can be later on recycled from the water by using a process such as filtration. Any copper particles left behind can easily mix with other wastes and become pollutant to the environment.
The board is then cleaned. Etching also takes place to allow for proper adhesion in the next stage. Once this has been carried out, there is an addition of another layer of conductor. The process of electrolysis copper plating is applied in order to conduct the holes that had been drilled previously. Both alkaline based and acidic based solutions such as copper sulfate can be used to enhance pH balance.
Photo imaging is used to achieve the final design of the circuit. The final thickness is also arrived at by electroplating copper. Protection of the final circuits in the next etching is quite vital and hence, a thin layer of tin or lead solder should be applied. The copper will not form the final circuit and should therefore be removed. Sulfuric acid or a solution containing ammonia is used to etch away the unwanted copper.
Other organic or photosensitive compounds can be used to obtain alternative resists. The compounds can be used when wet or dry. They will become hard when they are exposed to ultraviolet light.
In order to spread the liquid resist, one can use a silk screen, squeegee, roller or spray. One or both sides can have the liquid on. However, application can also be done to a specific area on the surface. Finer circuits can be produced by use of light.
The formation of multi layer panels is the final stage of this process. The inner cores of the layer are put together. The panels that are assembled together look like a copper foiled book with alternating epoxy sheets.
The book is positioned into a laminating press and then high pressure as well as heat is applied to it. The intense heat will eventually cause the sheets to melt down and a bond will be formed. Next, there are holes that are drilled into it. Prior to this, it should undergo some trimming and buffing. Manufacturing of PCB can only be successful if all these steps and guidelines are clearly followed to the latter.
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